PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

Data centers and cloud computing need multi-core and multi-socket scalability. And while the basic building blocks can be ...

A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...

A new technical paper titled “Enabling static random-access memory cell scaling with monolithic 3D integration of 2D ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

A technical paper titled “Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation” was ...

A new technical paper titled “Power Consumption Optimization of GPU Server With Offline Reinforcement Learning” was published ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

In the past, simulation was the only tool available for verification, but today there are many. Balancing the costs and ...